
Skycore Semiconductors Raises €5M Seed Funding to Power Next-Generation AI Data Centers
- The Denmark-based fabless semiconductor company pioneers Power Integrated Circuit (IC) solutions delivering extreme power density and efficiency for 800V HVDC architectures in next-generation AI data centers.
- Balnord invested in €5 million seed round alongside APEX Ventures, First Momentum, and Mätch VC. Combined with €2.5Min previous funding and grants, Skycore has raised approximately €7.5M to date.
- The funding will accelerate team expansion, product development, manufacturing capabilities, patent portfolio growth, and co-development projects with strategic partners in the rapidly growing AI infrastructure market.
Founded in Denmark, Skycore Semiconductors has developed a breakthrough Power IC technology platform that enables the development of power solutions for applications with extreme power density and efficiency demands. The company's silicon-validated technology addresses the critical power infrastructure challenges facing next-generation AI data centers, particularly the emerging 800V High Voltage Direct Current (HVDC) architectures that promise to revolutionize data center power and compute density.

The company's Power IC solutions deliver extreme power density and efficiency in a compact and flatform factor, addressing a critical bottleneck in scaling AI infrastructure. With a growing portfolio of 6 patent families and validated silicon technology, Skycore is developing the 800V HVDC power architectures that will power the next generation of AI factories.
"Skycore’s capacitor-based power chips are the core building blocks of that 800-volt architecture. What I really like about Skycore is how unobvious combinations can lead to real breakthroughs. The fusion of power electronics and chip design expertise at DTU – Technical University of Denmark has unlocked a new class of semiconductor technology.”
Jarek Pilarczyk, Operating Partner at Balnord.
The fresh capital will be used to expand the team across both technical and business development functions, accelerate product development and manufacturing capabilities, strengthen the company's patent portfolio, and establish a robust and scalable supply chain. The company will also execute co-development projects with potential customers and deepen engagement with strategic partners. This funding addresses an urgent industry challenge: today's AI factories are hitting the physical limits of 54 VDC power distribution, with copper busbars unable to efficiently serve racks exceeding 200 kW. As Nvidia's recent announcement confirms, the industry is racing toward 800V HVDC architectures to overcome these constraints—making Skycore's power-dense IC solutions essential for the AI infrastructure of tomorrow.
“Scaling today’s AI compute infrastructure requires a fundamental change in how data centers are powered, and 800V HVDC power architectures are the first step on that path. Our Power IC technology platform delivers power solutions with extreme power density and efficiency in flat, compact form factors, all essential to enable HVDC architectures. We design our solutions to be inherently scalable to meet the evolving demands of future power architectures. This funding enables us to accelerate our market entry from validated silicon to market-ready products, positioning Skycore as a key enabler of next-generation data center power delivery.”
Pere Llimós Muntal, CEO and Co-founder of Skycore Semiconductors.
Skycore is a Startup Member of the Open Compute Project (OCP), the largest collaborative community focused on redesigning hardware to efficiently meet the growing demands of compute infrastructure. The company is also a member of the Berkeley Power & Energy Center (BPEC) at the University of California, joining prominent industry members including Nvidia, Google, Intel, Tesla, and Analog Devices.
Previous investors include Morph Capital and Thorbjørn Rønje, who led earlier funding rounds that, combined with grants, provided €2.5M to validate the company's technology and build initial partnerships.
Today, Skycore's eight-person team plans modest growth while focusing on commercializing its Power IC solutions with strategic partners. The company is working toward market entry with its first commercial products, leveraging its validated technology platform and strategic partnerships to capture the rapidly growing market for AI data center power solutions.
Looking ahead, Skycore's vision is to become the global leader in Power Integrated Circuitsolutions for high-voltage architectures in next-generation AI data centers and other applications with extreme power demands.
Skycore Semiconductors is a Denmark-based fabless semiconductor company developing Power Integrated Circuit (IC) solutions for the next-generation of AI data centers. Built on a validated silicon platform and supported by a growing patent portfolio, Skycore's technology delivers extreme power density and efficiency in compact, flat form factors, addressing the rising power demands of 800V HVDC architectures. The company is partnering with leading industry players to push the boundaries of power-dense and scalable compute infrastructure. Skycore is a Startup Member of the Open Compute Project (OCP) and an industry member of the Berkeley Power & Energy Center (BPEC).